Use-After-Free Vulnerability in Snapdragon Auto, Compute, Connectivity, Consumer Electronics Connectivity, Consumer IOT, Industrial IOT, IoT, Mobile, Voice & Music, Wearables

Use-After-Free Vulnerability in Snapdragon Auto, Compute, Connectivity, Consumer Electronics Connectivity, Consumer IOT, Industrial IOT, IoT, Mobile, Voice & Music, Wearables

CVE-2019-14037 · HIGH Severity

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130

Learn more about our Cis Benchmark Audit For Bind.