Array Out-of-Bounds Access Vulnerability in SNDCP Module

CVE-2019-2303 · CRITICAL Severity

CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

SNDCP module may access array out side its boundary when it receives malformed XID message. in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9150, MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8976, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, SC8180X, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, Snapdragon_High_Med_2016, SXR1130, SXR2130

Learn more about our Industrial Pen Testing.